JPS58101080A - サ−マルヘツドの製造方法 - Google Patents
サ−マルヘツドの製造方法Info
- Publication number
- JPS58101080A JPS58101080A JP20000681A JP20000681A JPS58101080A JP S58101080 A JPS58101080 A JP S58101080A JP 20000681 A JP20000681 A JP 20000681A JP 20000681 A JP20000681 A JP 20000681A JP S58101080 A JPS58101080 A JP S58101080A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- thermal head
- layer
- wiring group
- heating resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title description 12
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 238000007772 electroless plating Methods 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 238000005530 etching Methods 0.000 claims abstract description 6
- 239000011888 foil Substances 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims abstract description 4
- 238000005553 drilling Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 23
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 229910052763 palladium Inorganic materials 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 241001609030 Brosme brosme Species 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20000681A JPS58101080A (ja) | 1981-12-14 | 1981-12-14 | サ−マルヘツドの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20000681A JPS58101080A (ja) | 1981-12-14 | 1981-12-14 | サ−マルヘツドの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58101080A true JPS58101080A (ja) | 1983-06-16 |
| JPS6227675B2 JPS6227675B2 (en]) | 1987-06-16 |
Family
ID=16417220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20000681A Granted JPS58101080A (ja) | 1981-12-14 | 1981-12-14 | サ−マルヘツドの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58101080A (en]) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59181591A (ja) * | 1983-03-31 | 1984-10-16 | 株式会社東芝 | 回路基板 |
| JPH0232867A (ja) * | 1988-07-22 | 1990-02-02 | Nhk Spring Co Ltd | サーマルヘッドの電極構造 |
| JPH02254785A (ja) * | 1989-03-29 | 1990-10-15 | Ngk Insulators Ltd | 回路基板の製造法 |
| US7015937B2 (en) * | 2002-08-27 | 2006-03-21 | Seiko Epson Corporation | Electrostatic latent image writing head, method of manufacturing the same and image forming apparatus incorporating the same |
-
1981
- 1981-12-14 JP JP20000681A patent/JPS58101080A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59181591A (ja) * | 1983-03-31 | 1984-10-16 | 株式会社東芝 | 回路基板 |
| JPH0232867A (ja) * | 1988-07-22 | 1990-02-02 | Nhk Spring Co Ltd | サーマルヘッドの電極構造 |
| JPH02254785A (ja) * | 1989-03-29 | 1990-10-15 | Ngk Insulators Ltd | 回路基板の製造法 |
| US7015937B2 (en) * | 2002-08-27 | 2006-03-21 | Seiko Epson Corporation | Electrostatic latent image writing head, method of manufacturing the same and image forming apparatus incorporating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6227675B2 (en]) | 1987-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6718631B2 (en) | Process for producing a flexible wiring board | |
| JP2002043752A (ja) | 配線基板，多層配線基板およびそれらの製造方法 | |
| JPS58101080A (ja) | サ−マルヘツドの製造方法 | |
| JPH1079568A (ja) | プリント配線板の製造方法 | |
| JPH04335596A (ja) | スルーホールプリント配線基板の製造方法 | |
| JPH0450744B2 (en]) | ||
| JP2884271B2 (ja) | 両面ｔａｂの製造方法 | |
| JPS59200427A (ja) | ハイブリツド集積回路 | |
| JP3709035B2 (ja) | ２層配線基板、及びその製造方法 | |
| JPH01290279A (ja) | 配線板及びその製造方法 | |
| JPS648478B2 (en]) | ||
| JPH06177277A (ja) | 半導体装置の製造方法 | |
| JPS63260198A (ja) | 多層回路板の製造方法 | |
| JP2000294674A (ja) | 半導体装置及びその製造方法 | |
| JPS6037640B2 (ja) | プリント基板 | |
| JPH024143B2 (en]) | ||
| JPH1117059A (ja) | ボールグリッドアレイ基板及びその連続体 | |
| JPS6175596A (ja) | スルホール多層回路基板の製造方法 | |
| JP2673363B2 (ja) | 回路基板およびその製造方法 | |
| JPS6148993A (ja) | 混成集積回路の製造方法 | |
| JPS622591A (ja) | 金属ベ−ス混成集積回路基板の製法 | |
| JPH0621651A (ja) | 多層配線回路板及びその製造方法 | |
| JPH0636601Y2 (ja) | 回路基板 | |
| JPH0222992Y2 (en]) | ||
| JPS62179200A (ja) | 多層回路基板の製造方法 |